The application for the IPO of Shenzhen Danbond Technology Co., Ltd. (“Shenzhen Danbond”) has been passed and approved on the 147th meeting of the Securities Public Offering Examination and Approval Committee of China Securities Regulatory Commission (“CSRC”) on July 6, 2011.

Since its establishment, Shenzhen Danbond's business focus is in the research and development, production and sale of FPC, COF and products of COF. The company has engaged in offering solutions and implementation plans to FCP in the fields of micro-electronics.

Shenzhen Danbond intends to offer 40,000,000 shares (accounting for 25% of its total issued shares) for the investment in the industrialization of FCP.

Grandall Shenzhen Office has been retained as the Issuer's Counsel. Mr. WANG Caizhang and Ms. ZHU Yongmei are the key Grandall attorneys servicing Shenzhen Danbond.